The ODU SPRINGTAC® Flatsocket with springwire technology is ideal for sensitive measurement tasks – especially in the field of test and measurement technology. Even during tests with high current loads, the socket ensures reliable results – with stable resistance values even during a high number of test cycles. Thanks to the compact design you can use the flatsocket for any common grid size.
The ODU SPRINGTAC® Flatsockets were specially developed for test and measurement technology, as they can reliably transmit even high test currents.
ODU LAMTAC®
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ODU SPRINGTAC®
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ODU SPRINGTAC® Flatsocket
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ODU TURNTAC®
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Primary attribute | High temperature & current | High mating cycles | High mating cycles | Rugged |
Contact technology | Lamella technology | Springwire technology | Springwire technology | Turned, slotted contacts |
Contacting | 19 lamella louvres with 2 contact points each (size ∅ 6 mm) | 44 wire springs (size ∅ 6 mm) | 30 wire springs (size 6.3 x 0.8 mm) | 4 contact fingers (size ∅ 6 mm) |
Nominal current | 115 A (size ∅ 6 mm) | 110 A (size ∅ 6 mm) | 27 A (size 6.3 x 0.8 mm) | 100 A (size ∅ 6 mm) |
Angular misalignment | +/- 1° | +/- 1° | +/- 5° * | |
Mating cycles | > 10,000 | > 100,000 | > 50,000 | > 10,000 |
Temperature range standard version | -40 °C to 150 °C | -40 °C to 125 °C | -40 °C to 125 °C | -40 °C to 125 °C |
Contact size** | from ∅ 1.5 mm | from ∅ 0.76 mm | from ∅ 0.64 x 0.64 mm | from ∅ 1.5 mm |
Standard plating | Ag / Au | Ag / Au | Ag / Au | Ag / Au |
Crimp termination | • | • | • | • |
Screw termination | • | • | • | • |
For busbars (through-hole design) | • | • | •*** |
* Max. 5° misalignment in the assembly position with a correspondingly designed contact chamber
** Other sizes on request
*** Optional
ODU SPRINGTAC® Flatsockets are the perfect, long‐lasting counterparts to traditional flat plug‐in contacts, especially for all manner of tasks in test and measurement technology. Their low, stable resistance values make them ideal for sensitive measurement tasks, as well as for tests in which high current‐carrying capacities are required.