The high‐performance ODU LAMTAC® contact system enables reliable connections at high temperatures of +150 °C and with current loads of up to 2,400 A. Depending on the design, one or more stamped lamella strips are installed in the turned bodies. The individual louvres on the lamellae provide a large number of contact points.
Thanks to their robust and compact design, ODU LAMTAC® Contacts are suitable for applications in industry, test and measurement technology, as well as the automotive sector (among others).
ODU LAMTAC®
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ODU SPRINGTAC®
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ODU SPRINGTAC® Flatsocket
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ODU TURNTAC®
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Primary attribute | High temperature & current | High mating cycles | High mating cycles | Rugged |
Contact technology | Lamella technology | Springwire technology | Springwire technology | Turned, slotted contacts |
Contacting | 19 lamella louvres with 2 contact points each (size ∅ 6 mm) | 44 wire springs (size ∅ 6 mm) | 30 wire springs (size 6.3 x 0.8 mm) | 4 contact fingers (size ∅ 6 mm) |
Nominal current | 115 A (size ∅ 6 mm) | 110 A (size ∅ 6 mm) | 27 A (size 6.3 x 0.8 mm) | 100 A (size ∅ 6 mm) |
Angular misalignment | +/- 1° | +/- 1° | +/- 5° * | |
Mating cycles | > 10,000 | > 100,000 | > 50,000 | > 10,000 |
Temperature range standard version | -40 °C to 150 °C | -40 °C to 125 °C | -40 °C to 125 °C | -40 °C to 125 °C |
Contact size** | from ∅ 1.5 mm | from ∅ 0.76 mm | from 0.64 x 0.64 mm | from ∅ 1.5 mm |
Standard plating | Ag / Au | Ag / Au | Ag / Au | Ag / Au |
Crimp termination | • | • | • | • |
Screw termination | • | • | • | • |
For busbars (through-hole design) | • | • | •*** |
* Max. 5° misalignment in the assembly position with a correspondingly designed contact chamber
** Other sizes on request
*** Optional
Experience the outstanding properties of the ODU LAMTAC® Contact System with lamella technology. With maximum current‐carrying capacity and high thermal stability, these contacts are the perfect choice for all high‐current contacting requirements across a broad spectrum of high‐power applications. Their minimal power loss enables maximum performance, even in the smallest of spaces.